2 pad ceramic package, 1.5 mm x 3.2 mm il3x series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 05/02/12_d specifications s ubject to change without n otice page 1 3.2 1.5 0.9 max. 1.0 1.35 connection diagram recommended pad layout dimension units: mm 1.0 1.8 2.5 product features: applications: ? 20 ppm stability real time clocks smd package metering low profile industrial control rohs compliant time reference compatible with leadfree processing frequency 32.768 khz esr (equivalent series resistance) 65 k ? max. shunt capacitance (c0) 1.7 pf typical frequency tolerance @ 25 ? c ? 20 ppm standard frequency stability over temperature parabolic -0.034 ppm / ? c 2 typical. inflection point approx. 27 ? c see graph below. crystal cut x-cut load capacitance 12.5 pf drive level 1 uw max. aging ? 3 ppm max. / year temperature operating -40 ? c to +85 ? c standard storage -40 ? c to +85 ? c standard typical x cut tem perature coefficient -180 -150 -120 -90 -60 -30 0 -40-30-20-100 1020304050607080 temperature ppm part number guide sample part number: il3x - hx5f12.5 - 32.768 khz package stability (ppm) at room temperature stability (ppm) over operating temperature operating temperature range mode (overtone) load capacitance (pf) frequency il3x - h = 20 ppm x = x cut 5 = -40c to +85c f = fundamental 12.5 pf - 32.768 khz
2 pad ceramic package, 1.5 mm x 3.2 mm il3x series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 05/02/12_d specifications s ubject to change without n otice page 2 pb free solder reflow profile: typical circuit: *units are backward compatible with 240c reflow processes package information: msl = n/a termination = e4 (au over ni over w base metal) tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: factory designator, date code (yww) quantity per reel 3000 a 12 +/-.3 b 8 +/-.2 c 5.5 +/-.2 d 13.5 +/-1 or 12 +/- 3 e 60 / 80 f 180 / 250
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